China CVD Diamond Supply Chain Directory 05: Processing, Testing and Integration

Batch 5 of Wonsen’s China CVD diamond supply-chain directory covers 21 entities involved in cutting, grinding, polishing, CMP, metallisation, bonding, packaging, heterogeneous integration, performance testing and ultra-precision machining.

Entries follow the source’s collection order, not a ranking of size, capability or recommendation. Multi-category businesses are classified by their publicly described principal products. Public-source verification is not independent technical testing or procurement endorsement.

Evidence boundary: The capabilities and numerical performance claims below are attributed to company materials. Measurement conditions, surface-quality metrics and product availability must be confirmed directly.

Directory

No.	Entity	Classification	Publicly reported scope
1	Anhui Guosheng Quantum Technology	D7 electrical/optical/radiation/quantum testing; E10 sensors/radiation detection; E9 quantum instruments	Diamond quantum magnetometers and microscopes, magnetic sensing and non-destructive inspection equipment, and NV-centre sensing instruments.
2	CIQTEK (Hefei) Technology	D7 quantum-property testing; E9 quantum instruments; D5 materials characterisation	NV-centre and quantum-diamond testing, single-spin spectrometers, NV microscopes and quantum precision-measurement instruments.
3	Jiuzhang (Jinan) Quantum Technology	D7 quantum-property testing; E9 quantum instruments	Educational platforms for NV-centre optically detected magnetic resonance, spin control and quantum-property measurements.
4	Anhui Lingguang Infrared Technology	D6 thermal conductivity/interface resistance/reliability testing	A lock-in-infrared thermal-wave conductivity instrument. The company claims accuracy two orders of magnitude above laser-flash methods and open measurement without cutting samples; these comparative and geometry claims require test-condition verification.
5	Hangzhou Guangyan Technology	D2 grinding/polishing/CMP	Distribution and licensed manufacture of IPPT gas-cluster ion-beam surface-etching equipment, with claimed nanometre-scale diamond surface processing for devices and bonding.
6	Wuxi Maiwei Optoelectronics Technology	D1 laser/wire cutting/patterning; D8 ultra-precision/optical machining	High-energy 532 nm green solid-state lasers for single-crystal diamond cutting and other hard-brittle materials such as SiC.
7	Guangzhou Mengzuan Technology	D1 cutting/patterning; D2 grinding/polishing/CMP	Diamond laser-cutting, shaping, grinding and polishing equipment.
8	Henan Heying Laser Technology	D1 cutting/patterning; D2 polishing; D8 precision machining	Describes CVD single-crystal cutters, MPCVD yellow-surface-layer laser cleaners and coaxial-vision seed-marking systems as mature products; diamond-copper cutters as sample-stage products; and polycrystalline diamond laser-thinning systems as under development.
9	Jiujiang Guangzuan Semiconductor Technology	D2 grinding/polishing/CMP; D1 cutting	Precision cutting, grinding and polishing services for CVD diamond.
10	Jiexin Semiconductor Equipment (Shenzhen)	D2 grinding/polishing/CMP; D8 precision machining	Diamond finishing processes and equipment combining plasma-assisted polishing and metal-film-induced self-sustaining graphitisation. Claims surface roughness at the 0.1 nm level and a damage-free layer; metrics and verification conditions must be confirmed.
11	Changchun New Industries Optoelectronics Technology	D8 ultra-precision/optical machining; E3 optical windows/lasers/terahertz	Ultra-precision diamond optical-window processing and CVD diamond windows for laser-crystal heat management.
12	Inno Laser Technology	D1 cutting/patterning; D8 precision machining	Ultrafast laser cutting and stealth-dicing equipment for diamond, wafers and other hard-brittle materials.
13	Jiangyin Huilong Technology	D3 metallisation/bonding/packaging; E4 thermal management	Metallised CVD diamond heat sinks for high-power chips and metallisation of aluminium nitride and CVD diamond.
14	Dongguan Zhongjia Semiconductor Technology	D4 heterogeneous integration; E5 power-device integration	GaN-on-diamond composite substrates and GaN wafers.
15	Qinghe Jingyuan Semiconductor Technology (Beijing)	D3 bonding/packaging; D4 heterogeneous integration; E5 power-device integration	Ultra-flat diamond surface preparation, wafer bonding and heterogeneous-integration services.
16	Hangzhou Yinhu Laser Technology	D1 cutting/patterning; D8 precision machining	Laser cutting, coring and precision-processing equipment for CVD and HPHT diamond.
17	Guangzhou Sanyi Laser Technology	D1 cutting/patterning; D8 precision machining	Laser cutting and processing equipment for CVD/HPHT diamond and PCD/PDC superhard materials.
18	Suzhou Jinghe Semiconductor Technology	D3 bonding/packaging; D4 heterogeneous integration; E6 AI cooling/advanced packaging	Room-temperature ultra-high-vacuum bonding, diamond heterogeneous integration and advanced-packaging services.
19	Tianjin Meiman Laser Technology	D1 cutting/patterning; D8 precision machining	Laser sources for CVD diamond, PCD, PcBN and single-crystal diamond cutting, and diamond-wafer laser grinding.
20	Wuxi Xinlei Precision Technology	D2 grinding/polishing/CMP; B5 processing/testing consumables	Equipment and processes for single- and polycrystalline diamond thinning, grinding, polishing and surface etching.
21	Suzhou Gaoyi Laser Technology	D1 cutting/patterning; D8 precision machining	Precision laser cutting, thinning and planarisation equipment for PCD, CBN, CVD/PDC and single-crystal diamond.

Corrections

Companies may contact Wonsen to confirm official English names or submit verified additions and corrections.

Entries will be updated as public information and verified company feedback become available.